Product Detail
Nine-knife cutting machine
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Nine-knife cutting machine

Type:Silicon wafer equipment
Development:Wire Cutting Business Division
Detailed introduction

Parameter attribute

Diameter of processing bar 210~330mm

Length of processing bar 500~6500mm

Length of processing bar 260~900

Feed speed ≥20mm/min; wire speed 0~25m/s

Diameter of diamond wire 0.35~0.42mm

Wire consumption ≤ 3.0 m/knife

Return rate ≥ 99.5%;

Flatness of end face ≤ 0.2mm; Parallelism of both ends ≤ 0.2mm

Section perpendicularity ≤ 0.8mm;

Dimension of machine tool 9650×3900×2300mm

Rated total power of machine tool 48kW; machine weight 17t

Advantages

Cutting size: Up to 6500mm;

Reasonable mechanical design: The new floating support structure ensures the cutting quality and stable operation of the equipment;

Easy operation; The threading operation is simple and fast, the whole process takes less than 10 minutes;

Stable tension control: Servo motor controls tension, stable and reliable, low calibration frequency;

High cutting efficiency: Double-station automatic loading and unloading, the loading and unloading part takes up cutting time, and the ingot is automatically cleaned;

Benefits

Each cutting ≤ 25min

12-18 tons of round bars are cut per day

Lead time

Standardized product: Delivery within 60 days after advance payment. Expedition is available according to the inventory and the quantity required; standard pricing

Customized product: Depending on the product, under normal circumstances, delivery in 90 days+ after advance payment; pricing is based on cost