Product Detail
Double-root vertical cutting machine system QSFA2395
Share to:

Double-root vertical cutting machine system QSFA2395

Number:QSFA2395
Type:Silicon wafer equipment
Development:Wire Cutting Business Division
Detailed introduction

Parameter attribute

Diameter of processing bar 210~330mm

Length of processing bar 100~950mm

Processing margin range 166~233mm

Cutting speed: ≥40mm/min;

Wire speed 0~25m/s

Diameter of diamond wire ≤0.42mm;

Wire consumption ≤0.08m/kg

Square bar side distance tolerance ± 0.20mm;

Edge distance of square bar ≤0.20mm

Angle on four sides of square rod ≤90°±0.1°

Four-sided flatness of square bar ≤0.2mm

Dimension of machine tool 4800×3020×3660mm (single machine)

Rated total power of machine tool 56kW;

Equipment weight 10t

Advantages

Stable performance:

(1) Vertical cutting, self-weight positioning of silicon rods;

(2) The cutting head cuts the axle box hole in one piece with high precision;

(3) Uniform cooling and good flatness;

High productivity, ≥4t/day:

(1) Fast cutting speed: ≥40mm/min stable cutting feed;

(2) Two silicon rods cut simultaneously;

(3) Loading and unloading time ≤ 3min

Low cost:

(1) One robot can be equipped with 2-4 main machines, which can form a cutting square manufacturing system, with low cost;

(2) The automation of the workshop is designed with ground rail transportation structure with low cost;

High precision:

(1) Cutting range ≤0.2mm;

(2) The loading and unloading accuracy of cutting is high, with a repeat positioning accuracy of ±0.05mm;

Benefits

Productivity, ≥4t/day

Lead time

Standardized product: Delivery within 60 days after advance payment. Expedition is available according to the inventory and the quantity required; standard pricing

Customized product: Depending on the product, under normal circumstances, delivery in 90 days+ after advance payment; pricing is based on cost