Product Detail
Ring wire cutting machine
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Ring wire cutting machine

Number:QDHA35400
Type:Silicon wafer equipment
Development:Wire Cutting Business Division
Detailed introduction

Parameter attribute

Diameter of processing bar Ø210~330mm

Length of processing bar 50~5000mm (customizable)

Length of processing bar 200~900mm

Cutting speed ≥25mm/min; wire speed 0~35m/s

Diameter of ring wire ≤0.65mm

Cutting time 6~8min; surface flatness ≤0.2mm

Ring circumference 2960mm; cutting seam width ≤0.65mm

The maximum length in the edge chipping area: T≤2mm (round rod), T≤1mm (square rod);

Dimension of machine tool 1960×1530×2500mm

Rated total power of machine tool 1.5kW; machine weight 3t

Advantages

Customizable cutting: It can cut silicon rods 5000mm or l ong;

Multiple functions: Cut off, remove the head and tail, and customize the special plane version according to customer requirements;

Good cutting quality: Surface flatness: ≤0.3mm, parallelism of both ends: ≤0.2mm, verticality of surface: ≤0.8mm, edge chipping T: ≤2mm (round rod);

Easy operation; The threading operation is simple and fast, the whole process takes less than 3 minutes;

Number of cutting: The number of cutting for a single loop wire ≥150;

Benefits

140-150 knives/day

Lead time

Standardized product: Delivery within 60 days after advance payment. Expedition is available according to the inventory and the quantity required; standard pricing

Customized product: Depending on the product, under normal circumstances, delivery in 90 days+ after advance payment; pricing is based on cost