Product Detail
Diamond wire slicer QP850+
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Diamond wire slicer QP850+

Number:QP850+
Type:Silicon wafer equipment
Development:Wire Cutting Business Division
Detailed introduction

Parameter attribute

Noise <80dB

Power cable 3×150+70mm²

Dimension of machine tool 4850×2000×3200mm

Maximum wire speed 40m/s

Length of processing bar ≤850mm

Size of processing bar 166×166mm~230×230mm

Cutting feed speed 0~9mm/min

Diameter of steel wire busbar Φ0.035mm~Φ0.040mm

Rated total power of machine tool 276kW; machine weight 16.5t

Advantages

High speed:

(1) ≥40m/s cutting;

Low cost:

(1) Flexible switching of multiple specifications to save switching time;

(2) Automatic docking and loading and unloading, less personnel required;

(3) High degree of automation of single machine;

(4) Stable tension control and high finished product;

Stable performance:

(1) Integrated casting of base and cutting chamber;

(2) One-piece cast headstock support,

(3) Special machine processing with high concentricity precision;

(4) Liancheng patented three-axis three-motor drive for cutting large-scale;

(5) Four guide rail feeding mechanism with high cutting precision;

Benefits

182 specifications: ≥1.15 million pc/month;

210 specifications: ≥1 million pc/month;

Lead time

Standardized product: Delivery within 60 days after advance payment. Expedition is available according to the inventory and the quantity required; standard pricing

Customized product: Depending on the product, under normal circumstances, delivery in 90 days+ after advance payment; pricing is based on cost