Parameter attribute
①Processing object: Solar single and polycrystalline silicon wafers, 166mm, 182mm, 210mm, 220mm, 230mm
②Tooling requirements: 120pcs customized flower baskets of 182mm silicon wafers; 104pcs customized flower baskets of 210~220mm silicon wafers
③Power requirements: 380V, 50HZ; 3-phase 5-wire system.
④Machine power: 357.9KW (motor power: 15.9KW; heating power: 282KW; Ultrasonic: 54KW; manipulator: 6KW)
⑤Municipal water/pure water: 2'' water inlet, pressure 2.5±0.5kg/cm2, water consumption 1.5m³/h;
⑥Air: Two 1/2″ air inlets (insert, cleaning), pressure 0.5~0.7Mpa; flow rate 15m³/h
⑦Air draft: 5000m³/h
⑧Equipment size: 18000*2800*2800mm (L*W*H)
Advantages
①Adopt Japanese Keyence bus communication system for multi-axis linkage, with accurate positioning, fast speed and no step loss;
②Absolute value bus servo: Fast response, and maintain power-down position;
③Quickly capture and process production data, connect with big data system to realize intelligent monitoring, the loading and unloading system supports RFID reading function, and the information can be connected to the production MES system in Ethernet mode. Support APP mobile phone interconnection system to operate and monitor the machine, automatically generate production reports, fault data analysis, and equipment life cycle management system.
④Multiple interfaces: Support code scanning gun, RFID, USB, serial port 232;
⑤Multiple link protocols: modbusTCP/IP, on-road link protocol, MC protocol, EtherNet/IP bus technology;
⑥Water-absorbing board (low chipping, front side spray with patented technology, good splitting effect, less sticking pieces), flower basket positioning (patented clamping flower basket end panel mechanism, which corrects the deformed flower basket)
⑦Slow pull (0-7 degrees adjustable tilt slow pull, so that the surface of the silicon wafer will be dried faster), drying tank (new method with invention patents, the cover of the tank vents the air, so that the wind in the tank The field is more uniform, which is conducive to drying and reducing debris and flakes)
⑧Compatible with silicon chip sizes of various specifications, and the switching time of each size does not exceed 4 hours.
⑨Well-protected: Mechanical hand pressure basket protection, multiple heating protection mechanisms
⑩Clean: Semiconductor standard applies for the equipment pipe, the ultrasonic cleaning tank is made of SUS316 material, and the drying tank is double-filtered
⑪DN25 oversized inlet pipe diameter, DN75 oversized discharge pipe diameter, 500L super large online fast heating tank
Benefits
①Features: Automatic insertion and cleaning of silicon wafers to meet the production capacity and quality requirements of solar silicon wafer cleaning
②Capacity: 182mm and below, ≥8000pcs/h; 182mm and above≥7000pcs/h
③Fragmentation rate ≤0.2% (excluding human factors and silicon wafer defect)
④Re-washing rate ≤ 0.1%, single crystal crack ≤ 0.2%, poly crystal crack ≤ 0.5% (except silicon wafer defect)
⑤Lamination rate: Lamination ≤0.1% (clean degumming without adhesion)
⑥It has a high degree of automation: UPTIME ≥ 98%, manual loading, automatic unloading, seamless connection of cleaning and sorting
⑦Take up small space: 8% narrower than other equipment
Lead time
①Standardized product: Delivery within 60 days after advance payment. Expedition is available according to the inventory and the quantity required; standard pricing
②Customized product: Depending on the product, under normal circumstances, delivery in 90 days+ after advance payment; pricing is based on cost
