Product Detail
Single wire cutting machine
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Single wire cutting machine

Number:QDA35250
Type:Silicon wafer equipment
Development:Wire Cutting Business Division
Detailed introduction

Parameter attribute

Diameter of processing bar 210~330mm

Length of processing bar 500~2500mm (customizable)

Length of processing bar 200~900mm

Cutting speed ≥25mm/min

Wire speed 0~25m/s

Diameter of diamond wire 0.35~0.42mm

Cutting time 6~8min

Parallelism of cutting ends 0.8 mm

Pay-off wheel BS60

Maximum edge chipping T≤2mm (T is the maximum length of edge chipping area)

Dimension of machine tool 5630×2000×2640mm

Rated total power of machine tool 19kW; machine weight 4.5t

Advantages

Customizable cutting: It can cut silicon rods 2500mm or l ong;

Multiple functions: Cut off, remove the head and tail, and customize the special plane version according to customer requirements;

Good cutting quality: Surface flatness: ≤0.3mm, parallelism of both ends: ≤0.2mm, verticality of surface: ≤0.8mm, edge chipping T: ≤2mm (round rod);

It has a high degree of automation: The loading and unloading station can be connected with automatic truss;

Easy operation; The threading operation is simple and fast, the whole process takes less than 3 minutes;

Low cost: The diameter of the steel wire is small, and the silicon loss is less, and the steel wire after cutting can be used to cut the steel wire to reduce the cost of consumables;

Benefits

150-160 knives/day

8-10t/day

Lead time

Standardized product: Delivery within 60 days after advance payment. Expedition is available according to the inventory and the quantity required; standard pricing

Customized product: Depending on the product, under normal circumstances, delivery in 90 days+ after advance payment; pricing is based on cost