Product Detail
Semiconductor ring diamond wire cutting machine (material movement)
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Semiconductor ring diamond wire cutting machine (material movement)

Type:Silicon (germanium) - based semiconductors
Development:Lianqiang Intelligent
Detailed introduction

Parameter attribute

Diameter of processing bar 120mm~320mm

Length of processing bar≤2500mm

Length of processing bar 2mm~500mm

Diameter of ring wire 0.50/0.65mm

Flatness of cutting surface ≤ 0.3mm

Parallelism of cutting ends ≤ 0.6mm

Verticality of cutting surface ≤0.5mm Cut length error ≤± 0.8mm

Cutting coolant pressure 0.15-0.3MP, flow 10--20L/min

Air source pressure 0.5-0.7 MP, flow 20 m³/h

Dimension of equipment6000x2100x29006

Rated total power of equipment 10 kw

Equipment weight 5.5t

Lead time

90 days after advance payment of main equipment