Parameter attribute
①Diameter of processing bar 120mm~320mm
②Length of processing bar≤2500mm
③Length of processing bar 2mm~500mm
④Diameter of ring wire 0.50/0.65mm
⑤Flatness of cutting surface ≤ 0.3mm
⑥Parallelism of cutting ends ≤ 0.6mm
⑦Verticality of cutting surface ≤0.5mm
⑧Cut length error ≤± 0.8mm
⑨Cutting coolant pressure 0.15-0.3MP, flow 10--20L/min
⑩Air source pressure 0.5-0.7 MP, flow 20 m³/h
⑪Dimension of equipment6000x2100x2900 mm
⑫Rated total power of equipment 10kW; Equipment weight 5.5t
Advantages
①Machine removes head and tail for sampling;
②Processing length and diameter can be customized according to customer requirements;
③It is convenient to load and unload silicon rods, equipped with loading trolley, which is easy to operate;
④One-way cutting of the ring line, high processing efficiency, damage layer on the truncated surface is shallow;
⑤The structure is simple, the failure rate is extremely low, and the operation of replacing the steel wire is simple;
Benefits
①12'' sillicon 20min/knife
②Surface roughness Ra ≤0.1um
③Surface flatness ≤0.1mm
Lead time
①90 days after advance payment of main equipment
