Parameter attribute
①Diameter of processing bar 150~220mm (6''-8'’)/200~320mm (8''-12'')
②Length of processing bar: 100~600mm (6''-8'')/100~450mm (12'')
③Grinding precision: Ovality≤0.05mm/L300mm
④Conicity≤0.05mm/L300mm
⑤Diameter accuracy＜0.05mm/L300mm
⑥Flat surface roughness Ra≤2μmArc surface roughness Ra≤2μm
⑦OF width: ±0.1mm
⑧V NOTCH depth: 1.00~+0.25mm
⑨Top R angle: R0.9~0.94mm (customizable)
⑩V angle:89°~93° (customizable)
⑪Crystal orientation accuracy: <±12′
⑫Intake pressure: 5~7bar
⑬Industrial water pressure: 0.25~0.35MPa
⑭Dimension of equipment: 4900×2810×2350mm
⑮Total power of equipment: 30kW
⑯Equipment weight: 10.5t
Advantages
①Silicon rod automatic centering and clamping
②Automatic measurement of silicon rod outer diameter
③The coarse and fine grinding of the outer circle is completed on the same equipment
④Automatic detection of crystallographic orientation
⑤Automatic calculation of positioning edge/Notch angle for precise machining
⑥With cleaning and drying system, convenient for secondary detection
Lead time
①90 days after advance payment of main equipment
