Product Detail
Oversized semiconductor slicer
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Oversized semiconductor slicer

Type:Silicon (germanium) - based semiconductors
Development:Lianqiang Intelligent
Detailed introduction

Parameter attribute

Maximum length of processed piece: 300mm

Maximum section size: Φ530mm/Φ700mm

Diameter of steel wire: Φ0.14~Φ0.18mm

Maximum stroke of workbench: 640mm

Cutting feed speed: 0.03~3mm/min

Equipment size: 4690×1650×2363mm

Equipment weight: About 10t

Advantages

Transverse feed is beneficial for the cutting fluid to enter the processing area along the steel wire, and the maximum transverse feed error does not exceed 0.015mm, with high processed surface quality.

The resolution of the cutting feed is up to 0.01mm/min, and it supports segmental speed setting during the cutting process. The speed control table can be directly transmitted from the PC to the control screen with high processing accuracy.

Three cutting rollers are used for processing, and the cutting roller frame can be quickly replaced to reduce waiting time.

Multi-stage tension control can ensure high tension in the cutting area and low tension in the take-up wheel at the same time, the tension of the cutting net is stable with low wire breakage rate.

Real time monitor of the status of processing process. It's also provided with auxiliary replacement system and automatic compensation system for take-up and pay-off reels, which are safe, reliable, and highly automated.

Lead time

90 days after advance payment of main equipment