Parameter attribute
①Length of processing silicon material≤450mm
②Diameter of processing silicon material≤210mm/310mm
③Cutting feed speed 0~9mm/min
④Maximum wire speed 30m/s
⑤Diameter of steel wire busbar ≥Φ0.045mm
⑥Dimension of equipment 4450×1900×3200mm
⑦Rated total power of equipment 188kW; Equipment weight 15t
Advantages
①The base of the machine and the support of the spindle box are all cast in one structure;
②The spindle is designed with angular contact bearing and oil and air lubrication, and cooling water is supplied by a separate water tank;
③Low inertia and lightweight one-piece roller, designed for easy replacement of the assembly structure;
④Operated on Siemens motion control system and motor;
⑤The vertical feeding adopts castings with additional 4 guide rail mechanism to reduce the TTV of the knife-edge slicing;
⑥The take-up and pay-off system is located on both sides of the equipment and installed on an integrated casting base to provide stable structure;
⑦Tension arm is light with short overhang length, and the angle of cable arrangement is close to 90°, which is convenient for cable control;
⑧The tension sensor range is 30N wight high control accuracy;
⑨High quality, free of silicon wafer surface quality TTV, line marks, and warping.
Benefits
①8'' cutting time ≤ 5 hours (note: in China, 8'' and 12'' are mainly mortar cutting, 8'' mortar processing takes 10 hours, and 12'' processing takes 18 hours)
Lead time
①90 days after advance payment of main equipment
