Product Detail
Silicon carbide single wire cutting machine
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Silicon carbide single wire cutting machine

Type:Silicon carbide equipment
Development:Lianqiang Intelligent
Detailed introduction

Parameter attribute

Diameter of processing bar: 100mm-200mm (4'' to 8'')

Length of processing bar:≤ 300mm

Diameter of diamond wire: 0.18~0.25mm (all tested)

Maximum cutting wire speed: ≤30m/s

Distance between centers of cutting rollers: 640-840mm

Direction of cutting: Bidirectional

Number of ingot cutting at the same time: 1

Diameter of cutting wheel: 220

Tension range: 0-120N

The storage capacity of take-up and pay-off reels: φ0.25mm*40km

Stroke of clamp table: 600mm

Workpiece swing frequency: 0~10 times/min

Workpiece swing angle: ±15 (rotary cutting is also possible)

Dimension of equipment: 3600×1900×2000mm

Equipment weight: 4.5t