Parameter attribute
①Processing diameter: 4~8''
②Maximum processing length: 20-25mm
③Grinding line speed: 35m/s
④Headstock spindle speed: 30-300r/min
⑤Workbench motor power: 1.5kw
⑥Workbench minimum feed rate: 0.005mm
⑦Workbench maximum feed speed: 6m/min
⑧Grinding frame feed motor power: 1.5kw
⑨Grinding frame minimum feed rate: 0.001mm
⑩Grinding frame maximum feed speed: 6m/min
⑪Dimension of equipment: About 3100*1750*1900mm
⑫Cooling mode: Running water or cutting fluid
⑬Rated total power of equipment: 7kW;
⑭Equipment weight: 2.5t
Advantages
①Support different processing specifications: Compatible with 4'', 6'', and 8'' silicon carbide processing;
②Processing length: Silicon carbide 20-25mm;
③Compatible with the processing requirements of generation 1 to generation 3 of semiconductor materials
④The equipment requires low energy consumption, with small footprint and lightweight;
⑤The whole machine cover reduces cutting fluid splash and oil leakage;
⑥High processing precision:
⑦Surface roughness Ra0.63 1.0; conicity 0.03/30mm; ellipticity 0.02/30mm
⑧Support different control systems: Such as Mitsubishi or Omron;
⑨The whole machine is equipped with automatic lubrication system;
⑩Integral welded base, with higher stability;
⑪The fixture is operated with hydraulic system and energy storage pump, and the workpiece will not fall when the power is off;
⑫The whole machine cover is used for better protection and easy maintenance;
